Production Process

01

Laser Drilling
02

Magnetron Sputtering
03

Grinding Board
04

Exposure
05

Electroplating
06

Des
07

OSP
08

Solder mask printing
09

Flying Probe Testing
010

FQC

Production Process Video Introduction

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Process Capability

Project	Thick film ceramic board process capabilities	DBC/DCB Copper Copy Ceramics Square Process Capability	DPC direct copper plating ceramic substrate process capacity	AMB activated metal welding ceramic substrate
Number of circuit layers	10 layer	2 layer	2 layer	2 layer
Biggest size	200*200mm	138*178mm	138*190mm	114*114mm
Minimum board thickness	0.25mm	0.30mm~0.40mm	0.25mm	0.25mm
Maximum board thickness	2.0mm	1L: 1.3mm; 2L: 1.6mm	2.0mm	1.8mm
Conductor thickness	5um-13um	3.9oz-8.6oz	2um-200um	8oz-22.9oz
Minimum line width/line distance	6/8mil (0.15/0.20mm)	12/12mil (0.30/0.30mm)	6/8mil (0.15/0.20mm)	20/20mil (0.50/0.50mm)
Substrate	One aluminum, aluminum nitride, oxidation, oxide	Alumina, aluminum nitride, oxide	Alumina, aluminum nitride, oxide, silicon nitride	Aluminum nitride, silicon nitride
Base material	0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.25, 1.5, 2.0mm	0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm	0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.25, 1.5, 2.0mm	0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm
Minimum	4mil (0.1mm)
Minimum hole distance	NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Minimum PAD ring (single)	6mil(0.15mm)	N/A	3mil(0.075mm)	N/A
PTH minimum hole wall copper thickness	4mil(10um)	N/A	4mil (10um)	N/A
Welding pad minor diameter	10mil(0.25mm)	8mil(0.20mm)	6mil(0.15mm)	8mil(0.20mm)
Group welding bridge	12mil(0.30mm)	8mil(0.20mm)	6mil(0.15mm)	8mil(0.20mm)
BGA pads minimum spacing	12mil(0.30mm)	8mil(0.20mm)	5mil(0.125mm)	8mil(0.20mm)
PTH/NPTH pore diameter tolerance	PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
Pole bias tolerance	± 4mil (0.1mm)
Tolerance	Laser cutting: +0.2/0.05mm; Mold type type: +0.25/0.20mm	Laser cutting: +0.2/0.05mm	Laser cutting: +0.2/0.05mm; Mold type type: +0.25/0.20mm	Laser cutting: +0.2/0.05mm
Line width/line distance tolerance	± 5mil (0.125mm)	± 5mil (0.125mm)	± 1mil (0.025mm)	± 5mil (0.125mm)
Surface treatment	AgPd, AuPd, Mn/Ni	OSP antioxidant/nickel plating, Shen Jin	OSP Antioxidation/Sinking Gold/Nickel Gold	OSP antioxidant/nickel plating, Shen Jin
Thermal Stress	1 hour @ 350℃	3 x 10 Sec @ 280 ℃	15 min @ 350 ℃	3 x 10 Sec @ 280 ℃