Ceramic PCB RFQ Checklist: Files and Specifications Needed for an Accurate Quote

What Do We Need to Quote a Ceramic PCB?

For most projects, the quotation package should include the following:

This information is usually enough for engineering to review the project and identify any missing requirements before pricing.

Ceramic PCB RFQ File Checklist

A complete manufacturing package should normally include:

• Gerber or Gerber X2
• ODB++ if available
• NC drill data
• Fabrication drawing
• Mechanical drawing or DXF
• Netlist if required
• Current part number and revision
• Special process or construction notes

The fabrication drawing should define information that cannot be read reliably from the artwork, such as:

• Ceramic material
• Ceramic thickness
• Copper thickness
• Metallization technology
• Critical dimensions
• Tolerances
• Flatness
• Surface finish
• Testing requirements

Make sure the revision shown on the drawing matches the Gerber and mechanical files.

What Ceramic Substrate Information Should You Provide?

“Ceramic PCB” is not a complete material specification.

The RFQ should identify the ceramic material when it has already been selected.

Common options include:

Also specify:

• Material grade or purity, if controlled
• Substrate thickness
• Thickness tolerance
• Required thermal conductivity, if critical
• Electrical insulation requirement
• Single-sided or double-sided construction

If the material is still open, provide the operating power, current, voltage, temperature, thermal load, mechanical conditions, and assembly method.

What Metallization and Copper Requirements Should Be Defined?

Ceramic circuits can use different metallization technologies, including:

• DPC
• DBC/DCB
• AMB
• Thin film
• Thick film

These processes differ in copper construction, feature capability, thermal performance, and cost.

If the process is fixed, state it clearly.

For example:

AlN substrate, 0.635 mm, double-sided DPC, finished copper 70 μm.

At minimum, provide:

• Finished copper thickness
• Single-sided or double-sided copper
• Minimum line width
• Minimum spacing
• Current requirement
• Metallized hole requirements

If the process is not fixed, provide the required finished copper, geometry, electrical load, and application so the manufacturer can review the most suitable process.

What Dimensions, Tolerances, and Special Features Matter?

Critical mechanical requirements should be shown clearly on the fabrication drawing.

Typical items include:

• Overall board dimensions
• Ceramic thickness
• Hole diameter
• Hole position
• Slots
• Cutouts
• Irregular outlines
• Laser scribing
• Flatness
• Edge condition
• Allowable chipping, if controlled

Only apply tight tolerances where they are functionally necessary.

A mounting hole may need close positional control, while a non-critical outer edge may not. Excessively tight tolerances can increase manufacturing difficulty and inspection cost without improving the final assembly.

Which Ceramic PCB Design Rules Should Be Confirmed Before Quotation?

There is no single set of ceramic PCB design rules that applies to every ceramic technology.

Manufacturing limits vary with:

• Ceramic type
• Metallization process
• Copper thickness
• Substrate thickness
• Board size
• Hole structure
• Mechanical processing

The main parameters to confirm are:

For prototype projects, a DFM review before production can identify features that may increase cost or reduce yield.

Tell Us How the Ceramic PCB Will Be Assembled

The downstream assembly process can affect the required surface finish.

Tell the manufacturer if the board will be used for:

• SMT soldering
• Die attach
• Aluminum wire bonding
• Gold wire bonding
• Silver sintering
• Probe contact
• Power module assembly

Possible surface finishes may include:

• ENIG
• ENEPIG
• Nickel/gold
• Silver
• Bare or protected copper
• Application-specific bonding finishes

If the finish has already been qualified, specify it directly.

If not, provide the assembly or bonding method so the manufacturer can confirm compatibility.

What Testing and Quality Requirements Should Be Included?

State any non-standard inspection or reliability requirements during the RFQ stage.

Typical requirements include:

• Electrical continuity test
• Isolation or Hi-pot test
• Dimensional report
• Copper thickness measurement
• Plating thickness report
• Flatness inspection
• Crack or chip inspection
• Adhesion or peel testing
• Solderability
• Thermal cycling
• Material certificate
• Certificate of Conformance
• Lot traceability

Separate qualification testing from routine production inspection.

For example:

Prototype: thermal cycling + dimensional report
Production: electrical test + visual inspection + COC

This avoids adding unnecessary test cost to every production lot.

What Quantity and Lead-Time Information Should You Provide?

Quantity affects both setup cost and unit pricing.

A useful RFQ may include:

Also provide:

• Target prototype date
• Expected production timing
• Annual forecast
• Requested price breaks

If the project may enter production, include the expected volume even when the first order is only a prototype batch.

This helps the manufacturer evaluate both prototype feasibility and future production cost.

What Changes the Ceramic PCB Cost?

The main ceramic PCB cost drivers are:

For an accurate ceramic PCB quote, send the actual design package rather than asking only for a general price per piece.

Ceramic PCB RFQ Template

Use this template for a new project.

Project Information

• Project name:
• Part number:
• Revision:
• Application:

Ceramic Substrate

• Ceramic material:
• Grade/purity:
• Substrate thickness:
• Board dimensions:
• Thermal requirement:

Circuit Construction

• Metallization process:
• Finished copper thickness:
• Single-sided / double-sided:
• Minimum line width:
• Minimum spacing:
• Hole requirements:
• Slots/cutouts:

Mechanical Requirements

• Critical dimensions:
• Critical tolerances:
• Flatness:
• Edge requirements:

Surface and Assembly

• Surface finish:
• Assembly method:
• Wire bonding / die attach requirements:

Quality

• Electrical testing:
• Dimensional inspection:
• Reliability testing:
• Required reports/certificates:

Commercial Information

• Prototype quantity:
• Production quantity:
• Annual forecast:
• Target lead time:

Attached Files

• Gerber:
• Drill:
• Fabrication drawing:
• Mechanical file:
• Other specifications:

Open Items

• Manufacturer recommendation requested for:

FAQs About Ceramic PCB RFQs

Are Gerber files enough for a ceramic PCB quote?

Usually not for a final production quote. The manufacturer also needs material, thickness, copper construction, tolerances, finish, quantity, and testing requirements.

What if I do not know which ceramic material to use?

Provide the operating power, thermal load, current, voltage, temperature, mechanical conditions, and assembly process. The manufacturer can then review the appropriate substrate material.

Do I need to specify DPC, DBC, or AMB?

Only if the process has already been selected. Otherwise, provide the copper thickness, line/space, thermal requirements, and application so the manufacturer can recommend a suitable process.

What has the biggest impact on ceramic PCB cost?

Material, metallization process, copper thickness, fine-line requirements, mechanical features, tolerances, testing, quantity, and lead time are usually the main cost drivers.

What should I provide for a ceramic PCB prototype quote?

Provide the manufacturing files, substrate and copper requirements, prototype quantity, testing requirements, and target delivery date. Include expected production volume if the project may move into mass production.

Can I request a quote before the design is completely finalized?

Yes. Mark uncertain items as open for manufacturer recommendation and provide the performance requirements behind them.

Why does the manufacturer need to know the assembly process?

The assembly method can affect surface finish, pad design, metallization, and cleanliness requirements. A board intended for SMT soldering may require different finishing considerations from one intended for die attach or wire bonding.

What commonly delays a ceramic PCB quotation?

Typical causes include missing substrate material, undefined copper thickness, inconsistent file revisions, unclear tolerances, missing mechanical data, undefined testing requirements, or no quantity and delivery information.